5510-2 Silicon Wafer Cutting Fluid

Superior Cooling: Quickly dissipates the intense heat between the wire saw and crystal silicon, ensuring stable cutting conditions. For example, it can reduce the temperature rise by over 30% compared to traditional coolants.

Exceptional Lubrication: Significantly reduces surface scratches, roughness, and diamond wire wear. Tests show it can extend the diamond wire lifespan by up to 50%.

Efficient Dispersing: Prevents silicon powder and worn silicon carbide particle redeposition, keeping wafer surfaces clean and facilitating degumming.

High Chemical Stability: Remains stable without ionic pollution or decomposition at high temperatures, ensuring reliable performance.

Cost-Effective Water Recycling: Ideal for large closed-cylinder recycling systems, reducing water and chemical consumption.

Semiconductor Wafer Cutting: 5510-2 Silicon Wafer Cutting Fluid ensures precise cuts with minimal surface damage, which helps maintain the integrity of the wafer surface, thus ensures optimal electrical performance.

Photovoltaic Solar Silicon Wafer Cutting: 5510-2 Silicon Wafer Cutting Fluid enhances the cutting process in solar panel production, thus improves efficiency and reduces waste.

Dilute the working fluid at a ratio of 1:200 - 400. Then, add it to the CNC equipment machining liquid tank.

Regularly check the tank fluid level and replenish water and original liquid proportionally.

Replace the tank fluid as per the specified schedule to maintain optimal performance.

Additionally, it should be noted that the product is packaged in plastic drums with options of 10KG, 20KG, and 25KG per barrel. These are non-dangerous goods, facilitating easy storage and transportation.

The storage period is 2 years, during which it must not be stored in the open air and should be protected from sunlight and rain.

For any barrel with unused fluid, ensure it is tightly sealed to prevent water and impurity mixing.