What is Wafer Cutting Fluid ?

Wafer cutting fluid plays a key role in the semiconductor manufacturing process, the following is a detailed introduction to the wafer cutting fluid:

I. Definition and Function

wafer cutting fluid, also known as wafer scribing fluid, is a lubricating coolant specially used in the semiconductor wafer cutting process. It is mainly used to divide large-size wafers into small-size chips by chemical cutting to ensure the precision and stability of the cutting process.

II. The Main Components

The main components of wafer cutting fluid include nonionic surfactants, disinfection active substances and other functional substances. These ingredients make it have various functions, such as eliminating silicon dust particles, disinfecting the pipelines of the production system, preventing the growth of microorganisms, preventing corrosion, reducing and neutralizing electrostatic charge, and so on.

III. Main Functions

1. Lubrication and cooling: The wafer cutting fluid can lubricate the dicing blade during the cutting process, reduce friction and surface tension, and at the same time act as a coolant to reduce the heat generated by friction and prevent wafer cracks.

2. Cleaning and protection: the protective fluid can effectively eliminate silicon dust particles, clean the surface of the wafer, while protecting the surface of the wafer from damage.

3. Elimination of by-products: In the cutting process, the wafer cutting fluid can eliminate the by-products generated to ensure the quality and stability of the chip.

Fourth, the use of the process

The use of wafer cutting fluid requires certain specialized knowledge and technology. First, the need to clean the wafer surface, keep it dry and clean. Then, drop the appropriate amount of protective solution on the wafer surface, and use a cotton swab or a specialized polishing cloth to spread it evenly. During the cutting process, the protective liquid will evenly cover the surface of the wafer to protect and cool the wafer.

V. Precautions

1. The protective fluid should be replaced regularly to prevent accumulation of contamination affecting the cutting quality.

2. There should not be particles and other impurities in the protective liquid, otherwise it will affect the focusing effect and cutting quality.

3. The temperature of the protective fluid should be controlled within the appropriate range, too high or too low will affect the cutting effect.

4. Before cutting, the protective fluid should be evenly sprayed on the wafer surface to avoid leakage, accumulation and other problems.

In summary, wafer cutting fluid is an indispensable part of the semiconductor manufacturing process, which can ensure the precision and stability of the cutting process, improve the quality of the chip and yield.