3M15 PCBA Cleaning Agent

a) Efficient cleaning and yield guarantee

• The product yield after cleaning can reach 99.9%, significantly reducing defects such as short circuits and corrosion caused by contaminants.

• After cleaning, dirt residues are automatically peeled off and sink to the bottom, avoiding secondary pollution and prolonging the service life of the cleaning solution.

b) Environmental protection features

• Production process and waste liquid treatment have no pollution discharge. The formula is biodegradable, reducing the long-term burden on the environment.

• RoHS compliance: Strictly follow the EU RoHS directive to ensure that the cleaning agent does not contain harmful substances such as lead and cadmium.

c) Material safety

• No corrosion to PCBA substrates (such as copper foil, solder joints, and components), ensuring the long-term reliability of the circuit.

• The surface remains unchanged in color and does not turn white after cleaning, maintaining the consistency of product appearance and function.

d) Safety

• No flash point characteristics eliminate the hidden danger of combustion and explosion caused by high temperature or static electricity.

• Special explosion-proof equipment is not required during the operation process, reducing safety control costs.

a) Consumer Electronics Manufacturing (High Precision & Miniaturization)

Designed for FPC flexible circuit boards and 0.3mm-pitch BGA packaging in smartphones and TWS earphones, this cleaner efficiently removes ionic residues and flux splashes around micro solder joints. Compatible with SIP (System-in-Package) chips' complex structures, it eliminates cleaning blind zones caused by capillary effects, ensuring >99.8% yield rate for high-sensitivity components like 5G RF modules.

b) Industrial & Automotive Electronics (High Power & Durability)

Ideal for IGBT modules and DCB ceramic substrates in EV powertrains, it rapidly decomposes high-viscosity silicone grease and Ag-sintering solder residues while protecting copper layers and Al₂O₃/AlN substrates from corrosion. Validated by 150℃ thermal cycling tests, it meets automotive-grade power devices' long-term reliability under extreme temperatures.

c) Advanced Packaging & Semiconductors (Delicate Structure Protection)

Tailored for FCBGA (Flip-Chip Ball Grid Array) and 2.5D/3D packaging, its low-surface-tension formula penetrates micro-bump (μbump) gaps, thoroughly removing underfill overflow and carbonized flux particles. TSV (Through-Silicon Via) compatible, it prevents electrical migration risks caused by residual liquid retention.

d) Medical & Aerospace (Zero-Defect & Compliance)

Compliant with MIL-PRF-28809F and ISO 13485 standards, it achieves particle-level cleaning for pacemaker PCBs and spacecraft control boards. The silicone/plasticizer-free formula passes <10ppm ionic residue tests, ensuring zero performance degradation in high-oxygen/vacuum environments.

a) Cleaning operation: The conventional cleaning temperature is controlled at 50-60℃, and the cleaning time is 1-10 minutes. For stubborn stains, the time can be appropriately extended.

b) Equipment maintenance: Regularly clean the sediment in the tank liquid. It is recommended to be equipped with a circulating filtration device to improve the cleaning effect.

c) Product treatment: For ultra-precision products, it is recommended to use spray equipment or high-frequency ultrasonic equipment to avoid damage to products caused by ordinary ultrasonic vibrations.

d) Packaging: Packaged in 25L/200L plastic drums. It is a non-dangerous product, which is convenient for storage and transportation.

e) Storage and transportation: The storage period is 2 years. It needs to be stored indoors to avoid sun and rain. For unused cleaning agents, tighten the barrel cap to prevent moisture and impurities from mixing in.