WC-200 Wafer Cutting Fluid

Superior Formulation: Made with high-quality grease and surfactants, it offers great cooling, lubrication, powder settling, and cleaning properties.

Surface Tension and Conductivity: Effectively lowers water surface tension and increases conductivity to prevent silicon powder adsorption.

Neutral and Gentle: A completely neutral product that doesn't affect the luster of metal parts on the wafer and is free from harmful and irritating ingredients.

Quality Improvement: Reduces problems like chipping, warping, and scratching, significantly enhancing product yield.

Eco-friendly: Environmentally friendly, biodegradable, and easy to handle waste liquid.

Wafer Cutting: Ideal for cutting various types of wafers, ensuring precise and smooth incisions, and reducing the risk of damage to the wafer surface.

LED Manufacturing: Used in the cutting process of LEDs, helping to improve the quality and performance of the final product by maintaining the integrity of the components.

Silicon Wafer Processing: Suitable for silicon wafer cutting, enhancing the cutting efficiency and the quality of the cut wafers.

Ceramic Substrate Cutting: Can be applied to cut ceramic substrates with good results in terms of cleanliness and surface quality.

First, dilute the original liquid at a ratio of 1:6 with pure water and add it to the pump. Then, use it according to the pure water pumping ratio set by the mixing pump.

The product has a shelf life of 24 months and is packaged in gallon jugs.